Aeluma, Inc. is a semiconductor company specializing in scalable, cost-effective sensor technologies for advanced LiDAR solutions. The company develops novel optoelectronic devices for sensing and communications applications, with a primary focus on infrared sensors for the automotive, industrial, and transportation sectors. Aeluma has pioneered a technique to manufacture devices using high-performance compound semiconductor materials on large diameter silicon wafers commonly used for mass market microelectronics. This technology has the potential to enhance performance and provide a path to cost-effective, large-scale manufacturing, which are critical factors for future LiDAR and other sensor applications.
The company's proprietary technology combines high-performance compound semiconductor nanomaterials with mass market silicon manufacturing. In September 2022, Aeluma achieved a materials technology milestone by demonstrating high-quality materials using its key manufacturing equipment at its headquarters in Goleta, California. Following this, in October 2022, Aeluma developed a device fabrication process for its sensors and leveraged its semiconductor materials to generate applicable baseline sensor devices.
Aeluma is also working on developing direct-on-silicon quantum dot lasers and semiconductor optical amplifiers. This approach aims to eliminate the need for costly and time-consuming steps associated with placing individual lasers on wafers, potentially streamlining the manufacturing process. The company operates from its headquarters in Goleta, California, which houses a state-of-the-art manufacturing cleanroom.
Key customers and partnerships
In December 2022, Aeluma entered into an agreement with the Research Foundation for the State University of New York (RFSUNY) to support AIM Photonics. This collaboration focuses on an ongoing government-directed project to develop the heterogeneous integration of compound semiconductor devices on silicon. The project builds on previous work under AIM Photonics' base award, which aimed to provide seamless access to high-performance lasers and amplifiers in manufacturable photonics platforms through the heterogeneous integration of diverse materials.
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