Kandou Bus

Kandou Bus, SA is a technology company specializing in innovative chip-to-chip interconnect solutions. The company's core technology, known as Chord signaling, utilizes spatial coding to transmit data between wired chips. This approach introduces correlations between signals sent on the interface, carefully chosen to lower power consumption, increase speed, and reduce footprint. Chord signaling is an extension of differential signaling, which sends correlated signals on two wires. The technology offers significant improvements over conventional chip-to-chip links, delivering 2-4 times bandwidth improvement and halving power consumption. Kandou's solution addresses the growing bottleneck in chip-to-chip interfaces, which has been affecting products ranging from cell phones to servers. The company's technology is applicable to various interconnect scenarios, including Through-Silicon Vias (TSVs) for stacked memory, interposers, and switch and server backplane interfaces. Kandou Bus has developed proprietary circuits and architectures for all parts of the transmission chain, including drivers, receivers, equalizers, clock and data recovery units, skew detection/mitigation, and support for legacy modes.