Sermon, a developer of AI chips for smart compact devices, has raised EUR 7.3 million (~USD 7.9 million) in a seed funding round led by Join Capital, with participation from SquareOne, OTB Ventures, and Onsight Ventures, among others.
The fresh funds will be used to accelerate Semron’s hardware and compiler development, expand its workforce, and push internationalization efforts. It plans to quadruple its team by the end of this year.
Based in Germany, Semron develops 3D-scaled AI inference chips for smart compact devices such as smartphones and earbuds. Its proprietary technology, CapRAM, utilizes a novel semiconductor device architecture based on a variable capacitor (memcapacitor), which increases chip energy efficiency by up to 20x. This enables the operation of larger AI models while maintaining the same chip size.
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